Polymers for use in heat resistant photoresist composition and process for preparing the same
US4316974A · kind A · utility
8Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1979 |
| Grant date | Feb 23, 1982 |
| Priority date | — |
| Expiry date | Dec 17, 1999 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0387
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 - positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.