Automatic plating apparatus
US4318793A · kind A · utility
3Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1980 |
| Grant date | Mar 9, 1982 |
| Priority date | — |
| Expiry date | Apr 21, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an automatic apparatus for plating, the plating assembly line is incorporated into a circuit assuming a rectangle in a plan view, and on said assembly line a plurality of support carriages carrying objects to be plated are successively conveyed to effectively carry out the desired processings of plating in different plating tanks, the objects being a plurality of strips and aligned and carried by said support carriage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.