Polyamide based thermoplastic body solder
US4318839A · kind A · utility
3Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1981 |
| Grant date | Mar 9, 1982 |
| Priority date | — |
| Expiry date | Jan 23, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/919
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An extrudable thermoplastic body solder which has the necessary physical properties for automotive applications is formed from a mixture of high and low viscosity nylons based on dicarboxylic acids and hexamethylene diamine filled with suitable particulate and fibrous fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.