High-impact polyamide molding resin compositions
US4320213A · kind A · utility
13Cited by
18References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1979 |
| Grant date | Mar 16, 1982 |
| Priority date | — |
| Expiry date | Oct 24, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide molding resin compositions are prepared by melt-blending a polyamide resin, a hydroxyl-functional elastomer and a succinic-functional coupling agent. The invention includes a process fore preparing the molding resin and the molded resin product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.