Method of manufacturing a solid-state image sensing device
US4321747A · kind A · utility
31Cited by
15References
1Claims
0Family size
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Key dates
| Filing date | May 23, 1979 |
| Grant date | Mar 30, 1982 |
| Priority date | — |
| Expiry date | May 23, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4981
Abstract
A solid-state image sensing device having an enhanced sensitivity to a short wavelength comprises an optical substrate for passing a predetermined light therethrough, a semiconductor substrate supported on the optical substrate and a plurality of electrodes formed on an insulating layer overlying the semiconductor substrate, in which a light corresponding to an object is incident from the optical substrate side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.