Process for coating substrates with high molecular weight epoxy resins
US4322456A · kind A · utility
24Cited by
20References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 11, 1980 |
| Grant date | Mar 30, 1982 |
| Priority date | — |
| Expiry date | Sep 11, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/688
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Substrates are coated with relatively high molecular weight epoxy resin coatings by applying to a substrate a mixture comprising PA1 (A) a relatively low molecular weight epoxy resin such as the diglycidyl ether of bisphenol A, PA1 (B) a phenolic hydroxyl-containing compound such as bisphenol A and PA1 (C) a catalyst for effecting a reaction between (A) and (B), and subjecting the coated substrate to a temperature of 120.degree. to 300.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.