Method of selectively depositing a metal on a surface
US4322457A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1978 |
| Grant date | Mar 30, 1982 |
| Priority date | — |
| Expiry date | Jan 25, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/182
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of selectively depositing a metal on a surface is disclosed. The method comprises selectively coating a surface with a surface active agent, having a first surface energy, to form a coated surface having a coated portion capable of burying a higher surface energy material applied thereto and an uncoated surface pattern not so capable. The selectively coated surface is then treated with a solution, having a second surface energy higher than the first, comprising a species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal and (2) an activating metal species capable of participating in an electroless metal deposition, to form a surface having the species deposited atop the uncoated pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.