Open cycle heat pump system and process for transferring heat
US4323109A · kind A · utility
27Cited by
1References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 27, 1979 |
| Grant date | Apr 6, 1982 |
| Priority date | — |
| Expiry date | Aug 27, 1999 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28C3/08
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Two or more open cycle vapor compression heat pumps of interdependently different capacities are placed in parallel arrangement intermediate a heat sink and a heat source for the transfer of sensible heat therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.