Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives
US4323662A · kind A · utility
42Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1980 |
| Grant date | Apr 6, 1982 |
| Priority date | — |
| Expiry date | Jul 8, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F222/406
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.