Method of making a die-stamped circuit board assembly for photoflash devices
US4325771A · kind A · utility
9Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1980 |
| Grant date | Apr 20, 1982 |
| Priority date | — |
| Expiry date | Mar 19, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.