Method of making a printed circuit board
US4325780A · kind A · utility
60Cited by
5References
8Claims
0Family size
Inventor
Key dates
| Filing date | Sep 16, 1980 |
| Grant date | Apr 20, 1982 |
| Priority date | — |
| Expiry date | Sep 16, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is manufactured by preparing a dielectric substrate with copper-clad surfaces, applying an etch-resist layer in a positive image of the circuit trace, etching away the exposed, non-circuit copper surfacing, and thereafter removing the etch-resist material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.