Thick film multilayer substrate
US4328531A · kind A · utility
184Cited by
10References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1980 |
| Grant date | May 4, 1982 |
| Priority date | — |
| Expiry date | Mar 27, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film multilayer substrate using a green ceramic sheet is constructed such that at least three conductor layers and at least two dielectric layers are alternately arranged in turn on the green ceramic sheet substrate, a power supply line being formed in the second conductor layer and thus interposed between the first and third conductor layers in which grounded conductors are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.