Process for attaching optical fiber to semiconductor die
US4329190A · kind A · utility
18Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1979 |
| Grant date | May 11, 1982 |
| Priority date | — |
| Expiry date | Jun 6, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.