Composite material
US4330599A · kind A · utility
25Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1980 |
| Grant date | May 18, 1982 |
| Priority date | — |
| Expiry date | Jun 9, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Novel and advantageous metal laminates particularly useful in making coins comprising a copper core and a cladding metallurgically bonded thereto of a copper base alloy containing from 2 to 3.5% aluminum, from 1 to 2.5% silicon and the balance essentially copper. Disclosure also teaches a method of preparing copper laminates by providing a copper core in strip form in the hard temper and a copper alloy cladding fully annealed in strip form, wherein the components are rolled together in a single pass with a reduction of from 50 to 75% to provide the metallurgically bonded laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.