Encapsulation for semiconductor device
US4330683A · kind A · utility
14Cited by
4References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 3, 1980 |
| Grant date | May 18, 1982 |
| Priority date | — |
| Expiry date | Dec 3, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor encapsulation of the chip carrier type has a collar-like protective housing member which encompasses the periphery of the chip carrier from which external lead members protrude. The protective housing member has a mating surface with a portion of the surface of the carrier. The interior of the protective housing member has recesses which accommodate the lead members singly, thus precluding their deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.