High performance semiconductor component with heat dissipating discs connected by brushlike bundles of wires
US4333102A · kind A · utility
8Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1979 |
| Grant date | Jun 1, 1982 |
| Priority date | — |
| Expiry date | Dec 18, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
On the two main surfaces of a semiconductor disc of a large diameter, high-performance semiconductor component, there are soldered one bundle each of metal wires. The other ends of the metal wires are soldered to heat dissipating discs. The metal wires, with increasing distance from the center, are of increasing lengths in order to absorb the differences in the thermal expansion of the semiconductor disc and the heat dissipating discs. Metal ring portions and a ceramic housing complete the semiconductorcomponent. A secure and desirable contact of the semiconductor discs is achieved without the application of pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.