Nodular copper removal from aluminum foil surfaces
US4337114A · kind A · utility
4Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1980 |
| Grant date | Jun 29, 1982 |
| Priority date | — |
| Expiry date | Oct 29, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Nodular copper is dissolved from aluminum foil surfaces by contacting the aluminum with a 0.1 to 2 M ammonium persulfate solution. The contacting temperature is 20.degree. to 40.degree. C., preferably 30.degree. C., and the contacting time is 1 to 10 minutes, preferably 2 minutes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.