Barrel plating apparatus
US4337135A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1980 |
| Grant date | Jun 29, 1982 |
| Priority date | — |
| Expiry date | Jun 30, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal plating process and apparatus is disclosed and includes a plurality of pre-plating stations comprising tanks or reservoirs containing various cleaning and rinsing solutions. A pulse plating or gold flash station including a plating tank is provided after the pre-plating stations, and a plurality of post-plating stations or tanks are provided after the pulse-plating station. Rotatable barrels for containing work loads are carried along a path of travel from station to station along the process. Differential speed mechanisms are provided along the process so that the work load containers rotate at a slower rate of rotation while traveling through air than while the containers are disposed within the various tanks or stations along the process. The pulse-plating of the work load at the plating station takes place in a chemical bath while rotating the work load within the bath, controlling the chemistry of the bath including the gold concentration, controlling the duty cycle of the pulse-plating operation, controlling the rotation of the work load within the bath, and controlling such other parameters as the bath temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.