Hermetic integrated circuit package for high density high power applications
US4338621A · kind A · utility
63Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 4, 1980 |
| Grant date | Jul 6, 1982 |
| Priority date | — |
| Expiry date | Feb 4, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.