Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices
US4339526A · kind A · utility
19Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1981 |
| Grant date | Jul 13, 1982 |
| Priority date | — |
| Expiry date | Jun 24, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protective coating is formed on an integrated circuit device by coating the device with a solution of acetylene terminated, branched polyphenylene prepolymer material and heating the material to form a thermoset crosslinked polymer layer. Selectively patterned portions may be provided when, after the coating step and prior to the heating step, the steps of imagewise exposure to radiation and rinsing with an organic solvent are carried out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.