Method and apparatus for depositing a material on a surface
US4340617A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1980 |
| Grant date | Jul 20, 1982 |
| Priority date | — |
| Expiry date | May 19, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for depositing a layer of a surface-compatible material from the fluid phase onto a selected surface of a substrate body in a fluid deposition chamber features a laser source of optically focused energy directed toward the body surface in a selected pattern. The energy is focused at a position adjacent the selected surface. Apparatus is provided for introducing a fluid medium adjacent the surface of the body. The medium has at least one component which absorbs a portion of the incident laser energy at the selected frequency for effecting photodecomposition or photolysis of the component in the fluid phase. Thereby, the product(s) of the photolysis process are deposited in the selected pattern on the substrate surface. The pattern may be fixed in position or may be optically or mechanically scanned across the substrate body. Thereby, metal layers, metal interconnects, pn junction and ohmic contact forming layers, selectively doped regions, etc. can be accurately deposited on the substrate surface, and in particular semiconductor substrate surfaces without the use of masks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.