Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems

US4341816A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Richard Lauterbach · Munich, DE
• Hartmut Keller · Weyarn, DE

Key dates

• Filing date: Jul 11, 1980
• Grant date: Jul 27, 1982
• Expiry date: Jul 11, 2000

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49885
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Disc- or plate-shaped targets for sputtering systems are attached to associated cooling plates by plasma-spraying a surface of such target with a compatible adhesive layer, for example composed of Ni; Ni/Cr mixtures; 80/20 Ni/Al mixtures; Ni/Al/Mo mixtures; Al/bronze mixtures; Mo; W; Al/Si mixtures, Zn, Cu, Cu/glass mixtures, etc., and then coating such adhesive layer with a solderable layer, for example composed of Cu, Cu/glass mixture or Ag, etc., and soldering such solderable layer onto the surface of a cooling plate. Preferably, the adhesive layer and the solderable layer are applied via plasma spraying.