Setting type resin composition containing a substantially linear, high-molecular-weight novolak substituted phenolic resin
US4342852A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1980 |
| Grant date | Aug 3, 1982 |
| Priority date | — |
| Expiry date | Dec 29, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a setting type resin composition comprising (A) a setting type resin and (B) 10 to 200 parts by weight, per 100 parts by weight of said resin (A), of a substantially linear, high-molecular-weight novolak type substituted phenolic resin which comprises a constituent phenol component comprised mainly of a bifunctional phenol and has a number average molecular weight of at least 1500. This resin composition has highly improved heat resistance and mechanical strength characteristics by virtue of incorporation of the high-molecular-weight novolak type substituted phenolic resin, and this improving effect is especially prominent when an epoxy resin is used as the setting type resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.