Active device substrate connector having a heat sink
US4345267A · kind A · utility
80Cited by
9References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1980 |
| Grant date | Aug 17, 1982 |
| Priority date | — |
| Expiry date | Mar 31, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.