Heat-stable polyphase polyamide/polyesteramide compositions
US4346024A · kind A · utility
16Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1980 |
| Grant date | Aug 24, 1982 |
| Priority date | — |
| Expiry date | Dec 5, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-stable polyphase polyamido compositions having improved mechanical properties are comprised of (i) from 55 to 99% by weight of a nylon polyamide resin matrix, said polyamide resin having a number-average molecular weight of at least 5,000, and (ii) from 1 to 45% by weight of a particulate disperse phase, said particulates having a particle size ranging from 0.01 to 10.mu., and said disperse phase comprising a polyesteramide having a content in amide groups of less than 40% of the amide groups comprising said polyamide matrix resin and a glass transition temperature of less than 5.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.