Method of applying an adhesive to a circuit chip
US4346124A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 1981 |
| Grant date | Aug 24, 1982 |
| Priority date | — |
| Expiry date | May 4, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying an epoxy glue, solder paste or a similar material to the surface of a planar circuit chip, such as a silicon integrated circuit chip. Positioned just above the liquid epoxy in the bath is a fine mesh, stainless steel screen clamped at its periphery and having supported thereover a leveling paddle with a micrometer adjustment rotatable relative to the bath itself for smoothing the material over the screen surface. After this smoothing or leveling operation, the chip, usually held by a vacuum chuck, is pressed against the screen into the epoxy with the screen functioning as a resilient means enabling the chip to be withdrawn therefrom with uniform deposition of material applied to the undersurface thereof. The apparatus may also have a spongy material such as polyurethane or a sponge neoprene rubber under the screen to enhance chip removal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.