Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture
US4346206A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1980 |
| Grant date | Aug 24, 1982 |
| Priority date | — |
| Expiry date | Aug 11, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.