Low profile optical coupling to planar-mounted optoelectronic device
US4346294A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1981 |
| Grant date | Aug 24, 1982 |
| Priority date | — |
| Expiry date | Jul 6, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Means and method for achieving a low profile optical coupling to a planar mounted optoelectronic device. Maintaining the optoelectronic device planar to the substrate on which it and associated circuitry are mounted enables the use of standard, well known manufacturing assembly techniques while providing electrical connection to the electric ports of said optoelectronic device. Optical fiber, light coupling is utilized. The low profile of the overall package is achieved by introducing the optical fiber on a plane which is generally parallel to the light-active surface of the optic port of said optoelectronic device. Actual optical coupling is achieved by introducing a smooth radius bend in the optical fiber so as to bring the fiber and the light-active surface of the optoelectronic device into generally orthogonal relationship. A glass-to-metal seal is provided where the optic fiber enters the package so as to provide a hermetic seal. Further mechanical and environmental support is provided by encapsulating the assembly, within its package, in an encapsulating medium having an index of refraction essentially matching that of the core of the optical fiber and the optic port of said …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.