Apparatus for mounting electronic components
US4346514A · kind A · utility
45Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1980 |
| Grant date | Aug 31, 1982 |
| Priority date | — |
| Expiry date | Feb 28, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting electronic components on a printed board substrate comprises PA1 a component feeder for sequentially feeding the electronic components in an aligned row, PA1 a chuck which receives and rectifies by pinching the position of the electronic components, PA1 a vertically movable mounting head, which holds by air suction one of the electronic components preliminarily pinched and rectified of the position by the chuck, and goes down through a wide open gap of the chuck to mount the electronic component on an accurate position of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.