Electrodeposition of copper, acidic copper electroplating baths and additives therefor
US4347108A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 1981 |
| Grant date | Aug 31, 1982 |
| Priority date | — |
| Expiry date | May 29, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Aqueous acidic copper plating baths and processes for electrodepositing bright and level copper coatings are described. In addition to containing one or more bath-soluble copper salts, free acid and chloride ions, the copper plating baths of the invention contain a brightening compound and a heterocyclic nitrogen or sulfur-nitrogen compound. The brightener compounds are prepared by reacting a mixture of PA0 (a) a disulfide having the formula EQU [RR'NCS.sub.2 ].sub.2 (Formula I) PA0 wherein R and R' are each independently hydrogen, alkyl or aryl groups, PA0 (b) a halo hydroxy sulfonic acid having the formula EQU X(CH.sub.2).sub.n CH(OH)CH.sub.2 SO.sub.3 M (Formula II) PA0 wherein X is a halogen, n is 1 or 2 and M is hydrogen or an alkali metal, and PA0 (c) an aliphatic aldehyde having up to 3 carbon atoms in PA0 (d) an aqueous alkaline medium. The heterocyclic compound may be 2-thiazolidinethione or its lower alkyl derivatives, 2-imidazolidinethione or its lower alkyl derivatives, and bath-soluble reaction products of these thione compounds with an alkyl aldehyde or dialdehyde.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.