Mounting arrangement for semiconductor optoelectronic devices
US4347655A · kind A · utility
33Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1980 |
| Grant date | Sep 7, 1982 |
| Priority date | — |
| Expiry date | May 5, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
Abstract
A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining a coaxial geometry, useful in optical and thermal control. Techniques for bonding devices into the package are easily automated using conventional bonding and assembly equipment. The package permits use of the device in a variety of orientations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.