Surface melting of a substrate prior to plating
US4348263A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 12, 1980 |
| Grant date | Sep 7, 1982 |
| Priority date | — |
| Expiry date | Sep 12, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/093
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Substrates for use in electrical contacts are prepared prior to plating by rapid surface melting by means of a laser beam or an electron beam. Improved microscopic surface characteristics are obtained. In a preferred embodiment, improved macroscopic surface roughness characteristics are also obtained by shorter-duration melting, typically by means of a pulsed YAG laser. Gold which has been electroplated onto copper alloys prepared by this technique has shown improved resistance to sulfur and chlorine corrosive atmospheres. This allows, for example, a thinner layer of a protective metal to be used to obtain a given degree of protection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.