Patent · US Expired

Heat stable molded phenolic resin article

US4348491A · kind A · utility

7Cited by

10References

18Claims

0Family size

Assignee

General Electric Company · US

Inventors

Michael D. Bertolucci · Greensboro, US
John R. Bartolomucci · Pittsfield, US

Key dates

Filing date	Oct 7, 1981
Grant date	Sep 7, 1982
Priority date	—
Expiry date	Oct 7, 2001

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L61/06
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A heat stable molded phenolic resin article comprising, in percent by weight, from about 20 to about 70 percent of an oil unmodified phenolic resin, from about 3 to about 25 percent of an acrylonitrile-butadiene elastomer, and from about 15 to about 70 percent of a silicate mineral. Also a molding composition comprising, in percent by weight, from about 20 to about 70 percent of an oil unmodified phenol-aldehyde thermosettable resin, from about 3 to about 25 percent of an acrylonitrile-butadiene elastomer, and from about 15 to about 70 weight percent of a silicate mineral.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.