Lower temperature glass and hermetic seal means and method
US4349635A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1981 |
| Grant date | Sep 14, 1982 |
| Priority date | — |
| Expiry date | Oct 26, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent: ______________________________________ Composition Range Element Pb-free Glass (Glass plus alumina) ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.3 13-21 11-21 ______________________________________
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.