Glass hermetic seal
US4349692A · kind A · utility
7Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1981 |
| Grant date | Sep 14, 1982 |
| Priority date | — |
| Expiry date | Jun 30, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved sealing glass composition for making compression glass electrical feedthroughs in semiconductor device packages is described wherein the improved sealing glass consists essentially of (by weight percent) 63-68% SiO.sub.2, 3-6% Al.sub.2 O.sub.3, 8-9% K.sub.2 O, 5-6% Na.sub.2 O, 0.5-1.5% Li.sub.2 O, 2-4% BaO, 5-7% SrO, 2-4% CaO, 0.5-1.5% MgO, 0.5-1.5% TiO.sub.2, and 0.5-1.5% B.sub.2 O.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.