Capacitive chip carrier and multilayer ceramic capacitors
US4349862A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1980 |
| Grant date | Sep 14, 1982 |
| Priority date | — |
| Expiry date | Aug 11, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip carrier system for supporting electronic semiconductor chips is provided with a matched coefficient of thermal expansion as well as a high value of capacitance. The carrier provides both mechanical and electrical connections to the chip. A small sized interposer for a silicon chip possesses high capacitance. An array of dot capacitors is formed between laminated layers of ceramic material. In some cases, conductive surfaces are provided on the upper and lower surfaces of a thin film of ceramic material in which dielectric bodies are interspersed in an array of openings therein. The resultant ceramic dielectric combination has a coefficient of thermal expansion which matches the coefficient of thermal expansion of the silicon chip and the substrate thereby relieving stress upon the solder ball joints between the interposer and both the chip and the substrate. This minimizes the mechanical stress upon the solder ball joints during thermal cycling of the structure. Alternatively, an array of multilayer ceramic capacitors has an array of dielectric bodies located within holes in ceramic layers between capacitor plates, or entire arrays of capacitors are formed in the space betwe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.