Thick film conductors for use in microelectronic packaging
US4350618A · kind A · utility
4Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1979 |
| Grant date | Sep 21, 1982 |
| Priority date | — |
| Expiry date | Nov 16, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area of the Pd to lower the Vbe rating. This reduces the potential for thermal runaway in subsequent integrated circuit operation. It has also been found that increasing the particle size of the Au component further decreases the Vbe rating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.