Apparatus for dipping plating
US4351266A · kind A · utility
10Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1980 |
| Grant date | Sep 28, 1982 |
| Priority date | — |
| Expiry date | Apr 17, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for dipping plating objects such as IC lead frame of a rectangular shape obtained by press forming and etching thin metal pieces, wherein a plural number of said rectangular sheets aligned and supported on the freely descending and returning rack base of the support carriage of the objects to be plated are concurrently subjected to dipping plating by determining the position of the said plural number of rectangular sheets to be plated for lowering into the plating tanks, and abutting the upper surface of the objects to be plated with the holding means thereby subjecting a plural number of objects to be plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.