Production method for solder coated conductor wiring
US4351704A · kind A · utility
4Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 18, 1981 |
| Grant date | Sep 28, 1982 |
| Priority date | — |
| Expiry date | Feb 18, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of production of solder coated conductor wiring wherein a lead layer and a tin layer are separately applied to the surface of a ceramic substrate in superposed relation, and subjected to heat treatment at a temperature suitable for alloying the lead and tin into a lead-tin alloy, to provide the solder coated conductor wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.