Mechanically assisted evaporator surface
US4352392A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 24, 1980 |
| Grant date | Oct 5, 1982 |
| Priority date | — |
| Expiry date | Dec 24, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A mechanically assisted evaporator layer for use in both open and evacuated heat transfer systems, in which a pump and spray nozzle operate in conjunction with a sintered metal evaporator layer to reduce the temperature difference required to transfer heat across the thickness of the surface and to permit smaller temperature differences and higher power densities in transferring heat. Liquid is pumped to and sprayed from a nozzle onto the sintered metal layer to keep the entire surface wetted at all times so as to permit uniform thin film evaporation from the surface. The continual presence of liquid at the outer evaporative boundary reduces the likelihood of surface dryout while the thermal conductivity of the sintered metal promotes more effective vaporization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.