Transparent digitizer platen
US4353952A · kind A · utility
14Cited by
2References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1981 |
| Grant date | Oct 12, 1982 |
| Priority date | — |
| Expiry date | Apr 27, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.