Ultra-thin wire for semiconductor connections

US4355082A · kind A · utility

Assignee

• W. C. Heraeus GmbH · DE

Inventors

• Albrecht Bischoff · Bruchköbel, DE
• Fritz Aldinger · Rodenbach, DE

Key dates

• Filing date: Jun 17, 1981
• Grant date: Oct 19, 1982
• Expiry date: Jun 17, 2001

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/1275
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

To prevent metal fatique, particularly when making a button loop, or nail head thermo compression bond connection to a semiconductor, the connecting wire has a core of copper, or a copper alloy of at least 60% copper content, and a jacket of aluminum, or aluminum alloy, of at least 95% aluminum content; in a preferred form, the core is 94% copper and 6% tin, and the jacket is, for example, 99% aluminum, 1% silicon; 96% aluminum, 4% copper; or 99% aluminum, 1% magnesium, all percentages by weight.