Electronic package and accessory component assembly
US4356532A · kind A · utility
53Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1980 |
| Grant date | Oct 26, 1982 |
| Priority date | — |
| Expiry date | Jul 18, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Common printed circuit board area usage is provided for electronic packages and accessory components by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed portions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.