Transfer lamination of vapor deposited foils, method and product
US4357395A · kind A · utility
57Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1980 |
| Grant date | Nov 2, 1982 |
| Priority date | — |
| Expiry date | Aug 22, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper-clad laminate having special utility in printed circuit board production because of its extremely smooth and virtually pinhole-free surface is made by vapor depositing a copper film on a layer of silica on an aluminum carrier sheet, electrodepositing a layer of copper on the film to form a foil, bonding the foil to a substrate and finally stripping the foil and substrate laminate from the silica-coated carrier sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.