Patent · US Expired

Method of embedding semiconductor components in plastics

US4358331A · kind A · utility

7Cited by

4References

5Claims

0Family size

Assignee

Licentia Patent-Verwaltungs-GmbH · DE

Inventors

Eckehard Schmidt · Walldorf, DE
Dieter Rusch
Manfred Tauber · Niebüll, DE

Key dates

Filing date	Mar 5, 1980
Grant date	Nov 9, 1982
Priority date	—
Expiry date	Mar 5, 2000

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/109
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of embedding semiconductor components in plastics comprising inserting components into the plastics material and thereafter hardening the plastics material by irradiation with high energy beams.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.