Printed circuit board soldering
US4360144A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1981 |
| Grant date | Nov 23, 1982 |
| Priority date | — |
| Expiry date | Jan 21, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of wave soldering an assembly composed of a plurality of electrical conductors disposed on a surface of a sheet of insulating material. In accordance with this method, the surface of the sheet and the conductors are contacted with a stationary wave of molten solder having a polyether admixed therewith and floating on the surface thereof. The polyether is a heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide. It is preferred that the alkylene oxide contain 2 to 4 carbon atoms. The alkylene oxide may be all ethylene oxide or may be a mixture with other lower alkylene oxides such as propylene oxides and butylene oxides. In any event, the copolymer should contain at least about 20 percent by weight of oxyethylene groups, balance oxypropylene groups and/or oxybutylene groups. A conventional polymeric oxidation inhibitor may also be included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.