Hot melt adhesive compositions comprising hydrogenated resin and ethylene-polar vinylic compound copolymer or wax
US4360622A · kind A · utility
7Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1981 |
| Grant date | Nov 23, 1982 |
| Priority date | — |
| Expiry date | Mar 13, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31696
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition comprising (I) a hydrogenated resin having a softening point of 60.degree.-130.degree. C. obtained by the hydrogenation of a copolymer resin prepared by reacting (A) at least one five-membered cyclic compound such as cyclopentadiene with (B) at least one dimer or trimer of the five-membered cyclic compound, isoprene and piperylene in specified ratios by weight, and (II) an ethylene type copolymer and/or wax.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.