Curable composition
US4360649A · kind A · utility
38Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1981 |
| Grant date | Nov 23, 1982 |
| Priority date | — |
| Expiry date | Apr 15, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising an epoxy resin, a hardener and an epoxy compound-dialkylamine adduct as a latent hardener. The composition is excellent in storage stability at ambient temperatures and rapidly curable under heating conditions, and is usable as adhesives, paints, molding materials, casting materials and so on.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.