Patent · US Expired

Method of making integrated circuits

US4361600A · kind A · utility

98Cited by
3References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 12, 1981
Grant dateNov 30, 1982
Priority date
Expiry dateNov 12, 2001

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/117
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of forming in a substrate of monocrystalline silicon semiconductor material having a major surface, a plurality of islands of silicon each including an active region of the substrate adjacent the major surface and surrounded by a body of silicon dioxide separating the islands from the substrate is described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.