Semiconductor speech path switch
US4364044A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 20, 1979 |
| Grant date | Dec 14, 1982 |
| Priority date | — |
| Expiry date | Apr 20, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1301
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In a semiconductor speech path at least a crosspoint element for forming a unitary matrix is formed on a semiconductor chip. The interconnections between the crosspoint elements and the matrix wirings are made on a ceramic wiring plate. By mounting a plurality of semiconductor chips on the ceramic wiring plate by face-down bonding, unitary matrix arrays are formed and at the same time the whole of a matrix array is formed. A row wiring having first speech path wirings and first selection wirings and a column wiring having second speech path wirings and second selection path wirings are doubly layered on the semiconductor wiring plate, with the intervention of an insulating layer therebetween. The upper layer, except for a pedestal region, is covered with a ceramic insulating layer. Terminals for row and column wirings are arranged in dual-in-line fashion. The speech path terminals of each of the row and column wirings are symmetrically and oppositely disposed to each other. This is correspondingly applied for the selection path terminals. With such a construction, the need for the multi-layered wiring on the semiconductor chip is eliminated, and the manufacturing of chips is simpli…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.